01 | Smart devices_

Electronics for IoT devices, Smart City systems and intelligent infrastructure.

From NPI and prototyping, through SMT/THT assembly, to testing, certification and series production of IoT devices, building automation and intelligent urban infrastructure.

Our Mission

Certified quality

SMT / THT:

Assembly of miniature components and complex electronic packages
NPI + Prototypes:

NPI support from documentation to serial production
CE + quality:

Inspection, testing and market compliance

02 electronics_

Scalability, miniaturisation and repeatability – the foundations of Smart Devices electronics.

Smart devices operate in environments that simultaneously demand compact design, low power consumption, reliable connectivity and repeatable production.

We build on experience gained in manufacturing our own electronic devices, which translates into a practical understanding of Smart Devices market requirements.

IoT devices and sensor systems:

Data acquisition modules, environmental sensors, mesh network nodes and edge computing devices.

Smart City and urban infrastructure:

Electronics for ground-level Smart City infrastructure: passenger information displays, ticketing kiosks, environmental monitoring and urban lighting management

Building automation and smart home

Controllers, communication modules and devices for smart buildings, HVAC systems and facility management.

Portable devices and wearables:

Miniature modules for trackers, portable terminals, wearable devices and field equipment.

Industrial IoT and Industry 4.0:

Electronics for machine monitoring systems, control rooms and remote management in industrial and logistics environments

Wireless communication systems:

BLE, Wi-Fi, LoRa, LTE-M, NB-IoT and other communication modules — for devices requiring reliable connectivity across diverse conditions.

03 | levels_

Project support at every stage of Smart Devices electronics development

Assembly of miniature components – 0201, fine-pitch, BGA – with fast NPI. From prototypes and pilot runs to high-volume production.

01
Documentation analysis:

Review of documentation, BOM and quality requirements before production start.
02
Process preparation and NPI:

Process setup, assembly optimisation and product launch support.
03
Component procurement:

Ordering of components and PCBs from qualified suppliers.
04
SMT / THT assembly:

Precision surface-mount and through-hole assembly.
05
Inspection and testing:

AOI, X-Ray, BGA/LGA/QFN inspection and functional testing.

04 | Markets_

Manufacturing approach aligned with Smart Devices requirements

Miniaturisation and fine-pitch:

Assembly of 0201 and smaller components, BGA, QFN and advanced multi-layer packages.

Fast NPI:

Efficient new product introduction – reducing time from prototype to serial production.

Volume scalability:

Flexible production from short runs and pilot batches to high-volume series.

Quality control:

AOI, X-Ray, functional and electrical testing for devices requiring market-grade reliability.

Traceability:

Full module traceability – from component to finished product – using QR and DataMatrix codes.

Final assembly (box-build):

Complete device assembly ready for shipment — programming, labelling and packaging in one place.

Compliance and certification:

Support for CE, RoHS and REACH certification preparation as part of a single partner’s responsibility.

ESD and environmental protection:

Production in an EPA and conformal coating protection for devices operating in harsh environments.

05 | who we work_

Who we work with in Smart Devices

Device manufacturers, IoT platform providers and companies developing intelligent infrastructure.

IoT device manufacturers

Smart City and public transport companies

Building automation integrators

Portable device and wearables manufacturers

Industry 4.0 and logistics companies

Start-ups and R&D teams

06 Manufacturing capability_

Manufacturing capability for Smart Devices electronics

PIXEL EMS supports electronics production from component preparation, through SMT/THT assembly and quality control, to testing, conformal coating and final assembly.

We have 2 SMT lines, assembly capacity of up to 350,000 components/h, laser PCB marking, SMD assembly under nitrogen atmosphere, selective soldering, AOI, X-Ray, BGA rework, conformal coating, functional testing and box-build.

Contact us – we’ll prepare an offer tailored to your company

Have questions? Fill out the form and our team will contact you to present a proposal tailored to your needs.

+48 52 324 16 10 office@pixelems.pl