01 | Machine park _

Discover the
PIXEL EMS
machine park

The modern PIXEL EMS machine park supports comprehensive electronics manufacturing – from component preparation and SMT/THT assembly, through quality inspection, to conformal coating, testing and final device assembly.

  • 01

    2
    SMT
    assembly lines

  • 02

    Up to 350,000
    components
    per hour

  • 03

    assembly of complex
    electronic packages
    up to 350 different components

02 | BRANDS _

Equipment from
world-leading brands

Assembly precision starts with the quality of the machines on which it is made.

01

Production
Preparation and Logistics

Full logistical and technical support
before the assembly line is launched.

  • Supply chain: Ordering electronic components and printed circuit boards from trusted suppliers.
  • Laser stencil cutting: In-house production of precision stencils for solder paste application, reducing order lead time.
  • Smart storage: Component storage systems in low-humidity conditions (Dry Storage), ensuring protection against aging and “popcorn” damage.
    ESD Safety: All production takes place in a certified EPA (ESD Protected Area).
02

Surface Mount
Technology (SMT)

SMT lines adapted to the most demanding projects.

  • Laser PCB marking: Automatic application of QR and DataMatrix codes, ensuring full traceability of each module.
  • SMD mounting under nitrogen: Soldering under nitrogen minimises oxidation, resulting in better wettability and higher aesthetics and durability of joints.
03

Through-Hole
Technology (THT)

Traditional through-hole assembly with selective soldering capability.

  • Wave soldering: Efficient assembly of through-hole components for large production runs.
  • Selective soldering: Precise THT soldering where protection of adjacent SMD components is required.
  • Hand soldering: Performed by certified technicians for complex or non-standard orders. (ESD Protected Area).
04

Inspection and
Quality Control

Advanced inspection for flawless assembly results.

  • Automated Optical Inspection (AOI): Fast and precise detection of assembly defects in 3D/2D technology.
  • X-Ray Inspection (RTG/X-Ray): Non-destructive inspection of solder joints under BGA, LGA and QFN packages, invisible to conventional cameras.
  • BGA rework station: Professional replacement and reballing of integrated circuits using advanced rework systems.
  • Quality control: In line with the highest industrial standards at every stage of the process.
05

Additional Processes
and Final Assembly

Products ready for sale or direct use.

  • Conformal Coating: Application of protective coatings (lacquering), protecting electronics against moisture, dust and chemicals.
  • Testing and commissioning: We carry out functional tests on assembled boards (PCBA) and complete devices in accordance with the customer’s specification.
  • Final assembly (Box-Build): Assembly of finished products – mounting electronics in enclosures, wiring and packaging.

A scientist studies what is. An engineer creates what has never been.

Theodore von Kármán

Gallery

PIXEL EMS supports projects in the most demanding technology sectors

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płytka PCB pixel